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| Surface Mount PTC FSMD Series FUZETEC Application: All high-density boards Product Features: Small surface mount, Solid state Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 140mA~1.6A Maximum Voltage: 6V~60V Temperature Range: -40 to 85 Agency Approvals: UL(E211981), C-UL TUV pending Electrical Characteristics(23 ) Part Number FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 Hold Trip Rated Max Typical Max Time to Trip Current Current Voltage Current Power Current Time IH,A 0.14 0.20 0.35 0.50 0.75 1.10 1.60 IT,A 0.30 0.40 0.70 1.00 1.50 2.20 3.20 VMAX,Vdc IMAX, A Pd, W 60 10 0.8 30 10 0.8 16 40 0.8 16 40 0.8 16 40 0.8 6 40 0.8 6 40 0.8 Amp 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Sec 0.02 0.02 0.10 0.15 0.02 0.30 0.5 Resistance Tolerance RMIN 1.50 0.80 0.32 0.15 0.11 0.04 0.03 R1MAX 6.50 5.00 1.50 1.00 0.45 0.21 0.10 IH=Hold current-maximum current at which the device will not trip at 23 still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I max) I MAX= Maximum fault current device can withstand without damage at rated voltage (V max). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour post trip. Termination pad characteristics Termination pad materials : solder-plated copper still air environment. 1 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series FSMD Product Dimensions (Millimeters) FUZETEC PART NUMBER FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 A Min 4.37 4.37 4.37 4.37 4.37 4.37 4.37 Max 4.73 4.73 4.73 4.73 4.73 4.73 4.73 Min 3.07 3.07 3.07 3.07 3.07 3.07 3.07 B Max 3.41 3.41 3.41 3.41 3.41 3.41 3.41 Min 0.7 0.4 0.4 0.4 0.4 0.4 0.4 C Max 1.0 0.7 0.7 0.7 0.7 0.7 0.7 D Min 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Thermal Derating Curve Thermal Derating Curve, FSMD Series 200% Percent of Rated Hold and Trip Current 150% 100% 50% A= FSMD 075, 100 &160 B= FSMD 014, 020, 035 0% -40 -20 0 20 40 60 80 & 050 Ambient Temperature (C) 2 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series Typical Time-To-Trip at 23 A =FSMD014 B =FSMD020 C =FSMD035 D =FSMD050 E =FSMD075 F =FSMD110 G =FSMD160 Time-to-trip (S) FUZETEC AB 100 C DE F G 10 1 0.1 0.01 0.001 0.1 1 Fault current (A) 10 100 Part Numbering System FSMD Current rating Example Part Marking System F110 F Part Identification Fuzetec Logo Standard Package P/N FSMD014 FSMD020 FSMD035 FSMD050 Pcs /Bag ----------------------------- Reel/Tape 2K 2K 2K 2K P/N FSMD075 FSMD110 FSMD160 Pcs /Bag ---------------------- Reel/Tape 2K 2K 2K 3 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 Surface Mount PTC FSMD Series Pad Layouts Solder Reflow and Rework Recommendations FUZETEC The dimension in the table below provide the recommended pad layout for each FSMD device Pad dimensions(millimeters) Device FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 FSMD160 A Nominal 3.45 3.45 3.45 3.45 3.45 3.45 3.45 B Nominal 1.78 1.78 1.78 1.78 1.78 1.78 1.78 C Nominal 3.15 3.15 3.15 3.15 3.15 3.15 3.15 Solder reflow Recommended reflow methods; IR , vapor phase oven, hot air oven. 2 The FSMD014 FSMD020 FSMD035 FSMD050 FSMD075 FSMD110 and FSMD160 devices are suitable for use with wave-solder application methods. 3 Recommended maximum paste thickness is 0.25mm. 4 Devices can be cleaned using standard industry methods and solvents. CAUTION: If reflow temperatures exceed the recommended Profile, devices may not meet the performance requirements. 1 Rework: Use standard industry practices. 4 DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2 |
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